COMPONENT REFERENCE / POWER

MOSFETs & power semiconductors

Choose around voltage stress, switching behaviour and the thermal path. Silicon MOSFETs, superjunction devices, SiC, IGBTs and rectifiers offer different trade-offs; a shared package does not make them interchangeable.

MOSFETs & power semiconductors
Component illustration

How the range is organised

Blocking voltage

Blocking voltage and actual transient envelope.

Conduction mechanism

Conduction mechanism: resistive MOS channel / conductivity-modulated IGBT / diode rectification.

Switching conditions

Commutation: hard/soft switching, reverse recovery, dead time and edge rate.

Thermal path

Thermal/mechanical system: PCB cooled discrete / heatsink mounted discrete / module.

A useful first comparison

FamilyCircuit jobFirst comparisonReview focus
Low- and medium-voltage silicon MOSFETsBattery and medium-voltage switchingHot RDS(on), gate charge, SOARecommended gate drive and applicable pulse/thermal SOA
High-voltage superjunction MOSFETsHigh-voltage silicon conversionRDS(on), Qoss/Eoss, diode commutationSwitching and diode-recovery data under comparable conditions
Silicon carbide MOSFETsHigh-voltage fast conversionDrive window, measured energy, loop inductanceRecheck gate drive, layout, protection and thermal design; determine changes from the exact device and operating conditions
IGBTsHigh-voltage/current conversion at suitable frequencyVCE(sat), Eon/Eoff, diode and protectionShort-circuit capability, protection timing and cooling conditions
Rectifiers and Schottky diodesUnidirectional power pathsVF + leakage + recovery + thermal pathCombined forward, leakage and recovery losses at operating temperature

Compare under the same temperature, test fixture and operating conditions. A family name is not a complete specification.

Compare the types

SOURCING IN CHINA

What Chinese suppliers can offer

Domestic portfolios include silicon MOSFETs, superjunction parts, SiC, IGBTs and rectifiers. Jilin Sino-Micro and Silan provide multiple process and package directions; CR Micro and Yangjie add further candidates in SiC and rectification. This widens the options for second sourcing and package-constrained designs. To establish an advantage, compare hot losses, drive changes, heatsinking and qualification costs together with the quotation.

Start with the right questions

  • Request an exact ordering code and current datasheet.
  • Compare samples under your actual electrical and thermal conditions.
  • Confirm the supply route, traceability and change-notification arrangements.

These guides explain selection principles. Final decisions require the current datasheet for the exact ordering code, operating conditions and appropriate application testing.

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